Transfer Thermal Conductive Tape

Description

Transfer Thermal Conductive Tape is a carrier-free thermal interface material designed for efficient heat dissipation and ultra-thin bonding applications. Without a supporting substrate, this tape provides maximum surface contact, allowing for improved thermal conductivity between components.

It is widely used in electronic assemblies where both thermal management and space optimization are critical. The absence of a carrier layer enables better conformability, excellent gap filling, and reduced thermal resistance.

AxisTape Transfer Thermal Tape is ideal for bonding heat-generating components such as ICs, LEDs, power modules, and heat sinks, delivering both strong adhesion and reliable thermal performance.

Available in multiple thickness options to meet different thermal design requirements.

Key Features & Technical Advantages

1. Carrier-Free Design for Maximum Thermal Efficiency

Unlike traditional tapes with PET or fiberglass carriers, this product features a pure adhesive structure.

Benefits include:

• improved surface wetting
• reduced thermal resistance
• better heat transfer efficiency
• enhanced contact between components

2. Excellent Thermal Conductivity

Designed to efficiently transfer heat away from critical components.

Key advantages:

• effective heat dissipation
• improved device performance
• reduced overheating risks
• extended component lifespan

3. Ultra-Thin & High Conformability

The absence of a carrier allows the tape to adapt to uneven surfaces.

• excellent conformability
• strong gap-filling capability
• suitable for micro-level bonding
• ideal for compact electronic designs

4. Strong Adhesion Performance

Provides reliable bonding between different materials.

Compatible with:

• aluminum heat sinks
• copper components
• PCBs
• plastic housings

Ensures stable adhesion under thermal cycling conditions.

5. Clean Processing & Easy Application

Designed for efficient manufacturing processes:

• easy die-cut compatibility
• clean removal of release liner
• suitable for automated assembly
• consistent thickness control

Available Thickness Options

To meet different thermal and structural requirements, the tape is available in:

• 130 μm – ultra-thin applications
• 190 μm – balanced thermal and bonding performance
• 250 μm – standard industrial use
• 380 μm – enhanced gap filling
• 500 μm – high gap-filling and uneven surface bonding

Custom thickness options are available upon request.

Typical Applications

1. Heat Sink Bonding

Used for attaching heat sinks to electronic components.

Provides:

• efficient heat transfer
• reliable bonding
• reduced need for mechanical fasteners

2. LED Thermal Management

Ideal for LED modules requiring stable thermal performance.

• improves heat dissipation
• enhances LED lifespan
• ensures stable light output

3. Power Electronics

Used in:

• power modules
• converters
• battery systems

Helps maintain stable operating temperatures.

4. Consumer Electronics

Applications include:

• smartphones
• tablets
• laptops
• wearable devices

Supports compact and lightweight designs.

Technical Specifications

Thickness	Adhesion Strength (g/inch2)	Thermal Conductivity (W/m*k)	Width (mm)	Length (m)
130 μm	≥ 1200	≥ 0.5	1000	50
190 μm	≥ 1000	≥ 0.55	980	50
250 μm	≥ 1000	≥ 0.5	900	50
380 μm	≥ 1000	≥ 0.5	1000	50
500 μm	≥ 1000	≥ 0.45	1000	50

(Custom specifications available upon request.)

Why Choose Transfer Thermal Conductive Tape?

Compared to carrier-based thermal tapes, transfer tapes provide:

• lower thermal resistance
• better surface contact
• improved heat transfer efficiency
• higher flexibility in tight spaces

AxisTape Transfer Thermal Tape is designed to meet the needs of modern electronics where thermal performance, compact design, and reliability are essential.

Customization & Manufacturing Capabilities

AxisTape offers flexible solutions for OEM and electronics manufacturers:

• custom thickness development
• roll width customization
• die-cut and converting services
• cleanroom production
• tailored thermal conductivity formulations

Our engineering team can assist in selecting the optimal solution for your application.

Quality Assurance

Each batch undergoes strict testing procedures:

• thermal conductivity testing
• adhesion strength verification
• aging and reliability tests
• dimensional stability checks

Ensures consistent quality and performance in real-world applications.

Frequently Asked Questions

Q: What is transfer thermal conductive tape?

A: It is a carrier-free adhesive tape designed for heat transfer and bonding between electronic components.

Q: What are the advantages of carrier-free thermal tape?

A: It provides better thermal contact, lower thermal resistance, and higher conformability compared to carrier-based tapes.

Q: How do I choose the right thickness?

A: Thinner tapes are ideal for flat surfaces, while thicker options provide better gap filling for uneven surfaces.

Q: Is it suitable for die-cut processing?

A: Yes. The tape is fully compatible with precision die-cut and automated assembly processes.

Q: Can it replace thermal grease or pads?

A: In many applications, yes. It provides both thermal conductivity and bonding in a single solution.

Ordering & Technical Support

AxisTape provides flexible minimum order quantities, competitive pricing, and worldwide delivery. For custom specifications or technical inquiries, please feel free to contact us for a detailed consultation or email us at info@axistape.com.