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- Excellent Electrical Conductivity: The metal-plated conductive foam structure provides stable surface conductivity for EMI shielding, grounding, and interference isolation applications.
- Advanced EMI Shielding Performance: The material helps reduce electromagnetic interference leakage in electronic housings, LCD frames, communication devices, and high-frequency equipment.
- Flexible Foam Cushioning: The foam base provides cushioning and shock absorption, making it suitable for applications requiring both conductivity and mechanical protection.
- Single-sided Conductive Acrylic Adhesive: The conductive pressure-sensitive adhesive backing allows easy fixation on shielding devices, panels, frames, enclosures, and electronic components.
- Suitable for Special Environments: The material is designed for electronic, communication, industrial, and anti-static applications where stable conductive contact is required.
- Custom Die-cut Processing: AxisTape can process the material into custom gasket shapes, holes, strips, pads, frames, or half-cut parts according to CAD drawings or samples.
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- Excellent Surface Conductivity: The copper-plated conductive foam structure provides stable conductive contact for EMI shielding, grounding, and interference isolation applications.
- EMI Shielding Performance: The material helps reduce electromagnetic interference leakage in electronic enclosures, LCD frames, communication devices, and high-frequency equipment.
- Cushioning and Shock Absorption: The foam base provides buffering and shock absorption, making it suitable for applications requiring both conductivity and mechanical protection.
- Single-sided Conductive Acrylic Adhesive: The conductive pressure-sensitive adhesive backing allows easy fixation on shielding devices, panels, frames, housings, and electronic components.
- Flexible Installation Design: Different cross-sectional shapes, installation methods, UL rating options, and shielding performance levels can be selected according to project requirements.
- Precision Die-cut Processing: AxisTape can process the material into custom gasket shapes, strips, holes, frames, pads, half-cut parts, or special profiles based on CAD drawings or samples.
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- Reliable EMI Shielding Performance: The conductive fabric-over-foam structure helps shield high-frequency electromagnetic interference and supports stable electrical contact between components.
- Flexible Foam Core: The foam base provides good compression and recovery, allowing the gasket to fill gaps and maintain contact pressure in electronic assemblies.
- Conductive Fabric Surface: The wrapped conductive fabric improves surface conductivity and helps create an effective shielding path for EMI control and grounding applications.
- Single-sided Acrylic Adhesive: The pressure-sensitive adhesive backing allows easy positioning and fixation on shielding devices, housings, panels, and electronic components.
- Precision Die-cut Processing: AxisTape can process the material into custom gasket shapes, strips, holes, half-cut sheets, and special section profiles based on customer drawings.
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Low-Profile EMI Shielding Tape with Black Surface for Consumer Electronics
- Black Surface for Aesthetic Integration: Designed for applications where appearance matters.
- Reliable EMI Shielding Performance: Provides effective protection against electromagnetic interference.
- Good Electrical Conductivity: Ensures reliable grounding and electrical continuity.
- Thin & Lightweight Design: Optimized for compact electronic devices.
- Strong Adhesion & Compatibility: Provides stable bonding across various substrates, maintains adhesion under normal operating conditions.
- Excellent Processing Performance: Designed for high-efficiency manufacturing.
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High-Performance EMI Shielding & Grounding Tape with Woven Conductive Fabric
- Excellent EMI Shielding Effectiveness: Designed to minimize electromagnetic interference.
- High Electrical Conductivity: The woven conductive structure ensures consistent electrical performance.
- Reinforced Woven Structure: Ideal for applications requiring durability and precision.
- Strong Adhesion to Multiple Substrates: Provides reliable bonding to a wide range of materials, ensures stable attachment even under vibration or thermal cycling.
- Good Flexibility with Structural Stability: Balances flexibility and strength, suitable for both flat and semi-flexible applications.
- Easy Processing & Manufacturing Compatibility: Optimized for industrial production.
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Flexible EMI Shielding & Grounding Tape for Electronic Assemblies
- Excellent EMI Shielding Performance: Designed to reduce electromagnetic interference in electronic devices.
- High Electrical Conductivity: The conductive fabric structure ensures reliable electrical performance.
- Superior Flexibility & Conformability: The non-woven fabric structure offers exceptional adaptability.
- Strong Adhesion Performance: Provides secure bonding across various materials, ensures stable attachment under mechanical stress.
- Easy Processing & Application: Optimized for modern manufacturing.
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High-Conductivity EMI Shielding & Grounding Tape for Electronics and Industrial Applications
- Excellent Electrical Conductivity: Copper provides superior conductivity for high-performance applications.
- Superior EMI Shielding Performance: Designed for effective electromagnetic interference protection.
- Conductive Adhesive for Full Electrical Contact: Available with conductive adhesive for enhanced performance.
- Strong Adhesion & Durability: Provides reliable bonding across multiple surfaces, maintains adhesion under thermal and mechanical stress.
- Excellent Formability & Flexibility: Copper foil allows easy shaping and installation.
- Corrosion Resistance Options Available: Optional treatments and coatings provide improved oxidation resistance.
