30μm Super Thin ESD Polyimide Kapton Masking Tape

  • Ultra-thin Construction: 30μm thickness provides minimal bulk while maintaining durability.
  • High Adhesion: Strong silicone adhesive ensures secure bonding to electronic components.
  • Heat Resistance: Performs reliably in high-temperature environments without degradation.
  • Non-residual Removal: Leaves surfaces clean after removal, protecting sensitive substrates.
  • Versatile Use: Supports temporary fixing, masking, surface protection, and damming in electronic manufacturing.

Reliable Industrial Solutions You Can Trust

  • Done Consistent Industrial Quality
  • Done Fast Sampling & Custom Solutions
  • Done Reliable Global Supply & Technical Support

Description

30μm Super Thin ESD Polyimide Kapton Tape is a single-sided, high-precision adhesive tape made from polyimide film with a silicone adhesive coating. It offers excellent heat resistance and superior adhesion, making it ideal for temporary fixing, masking, and protecting delicate electronic components during manufacturing, assembly, and transport processes. The tape provides reliable surface protection without leaving residue, supporting high-temperature and high-precision applications.

Key Features

  • Ultra-thin Construction: 30μm thickness provides minimal bulk while maintaining durability.
  • High Adhesion: Strong silicone adhesive ensures secure bonding to electronic components.
  • Heat Resistance: Performs reliably in high-temperature environments without degradation.
  • Non-residual Removal: Leaves surfaces clean after removal, protecting sensitive substrates.
  • Versatile Use: Supports temporary fixing, masking, surface protection, and damming in electronic manufacturing.

Applications

  • Carrier Protection: Supports thin-layer materials and protects during transport.
  • Temporary Fixing: Secures components during high-temperature manufacturing processes.
  • Masking: Ideal for package manufacturing and assembly processes.
  • Surface Protection: Protects CCD glass, PCBs, and other sensitive substrates.
  • Dam Application: Prevents resin leakage during molding of semiconductor packages and other electronic components.

Technical Specifications

Material Polyimide Film
Thickness 30μm
Adhesive Silicone, Single-sided, Pressure Sensitive
Adhesive Strength [g/25mm] 100-150
Backing Polyimide Film #20
Shelf Life Use within 12 months from delivery
Storage condition Store at 16–27°C and 40–60% R.H.

 

Customizable Options

  • Roll Size: 3″ paper or plastic core, tape width 2mm–1200mm, standard width 1200mm, standard length 50M.
  • OEM Size: Special length, thickness, or combinations can be supplied per customer request.
  • Shapes: Can be supplied in roll, tape, sheets, or die-cut shapes if CAD drawing is provided.
  • Thickness Variants: Can adjust thickness for specific processes or customer requirements.

Ordering & Technical Support

AxisTape provides flexible minimum order quantities, competitive pricing, and worldwide delivery. For custom specifications or technical inquiries, please feel free to contact us for a detailed consultation or email us at info@axistape.com.

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