Showing 157–168 of 202 results
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- Weatherproof & Durable: Resistant to environmental exposure without losing waterproof performance.
- Wide Temperature Range: Operates effectively from -5 °C to 40 °C.
- Excellent Sealing: High-performance water and moisture resistance for over 20 years of service life.
- Easy Application: Tear-off design enables quick and convenient use.
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- High Thermal Conductivity: Quickly transfers heat from components to heat sinks or cooling surfaces.
- Phase-Change Efficiency: Adapts under heat, lowering thermal resistance for superior heat dissipation.
- Stable Long-Term Performance: Maintains consistent thermal properties through repeated heating cycles.
- User-Friendly Application: Flexible sheets easily conform to component surfaces, with improved performance under pressure.
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- Wide Thickness Range: Available in standard thickness options from 0.1 mm to 0.4 mm to accommodate diverse applications.
- Superior Thermal Conductivity: Ensures rapid heat transfer and lowers component operating temperatures.
- Strong Adhesion: Double-sided bonding ensures reliable fixation for LED modules, ICs, and flexible circuit boards.
- Stable and Economical: Maintains performance through repeated thermal cycles while remaining cost-effective.
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- Excellent Initial Adhesion and Peel Strength: Provides fast bonding performance and reliable peel adhesion for nameplates, films, panels, foam parts, and electronic components.
- Good High-temperature Holding Power: Maintains stable adhesion on various surfaces under temperature changes, with reference temperature resistance from -20°C to 120°C.
- Easy Die-cutting and Converting: The tissue backing offers good handling performance for slitting, laminating, die-cutting, and custom adhesive part production.
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- Strong Double-sided Adhesion: Provides reliable bonding strength for different substrates and assembly surfaces.
- Good Holding Power: Designed to maintain long-lasting adhesion under pressure and daily use conditions.
- Resistance to Rebound and Warping: Helps reduce edge lifting, bouncing, and deformation after application.
- Heat and Temperature Resistance: Suitable for applications requiring moderate heat resistance, with a working range of approximately -20°C to 100°C.
- Easy Processing and Clean Application: Easy to peel, apply, slit, laminate, and die-cut for converting and industrial production.
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- Enhanced Double-sided Bonding Strength: Provides strong adhesion performance with stickiness of ≥18N, suitable for applications requiring firmer attachment than lighter-duty tissue tape options.
- Reliable Holding Performance: Maintains stable bonding under pressure and long-term use, with retention performance of ≥48H / 1kg / in².
- Good Resistance to Rebound and Edge Lifting: Helps reduce warping, bouncing, and peeling on curved, slightly uneven, or assembled surfaces.
- Heat and Temperature Resistance: Performs within a working temperature range of approximately -20°C to 100°C, suitable for moderate heat-resistant bonding applications.
- Clean and Efficient Processing: Easy to peel, apply, slit, laminate, and die-cut, making it suitable for converting, assembly, and production-line use.
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- Strong Double-sided Adhesion: Offers reliable bonding strength with stickiness of ≥18N, suitable for industrial assembly and material mounting applications.
- Stable Holding Power: Designed to maintain long-lasting adhesion after application, with retention performance of ≥48H / 1kg / in².
- Resistance to Rebound and Edge Lifting: Helps reduce bouncing, curling, warping, and peeling on curved or slightly uneven surfaces.
- Heat and Temperature Resistance: Performs within a working temperature range of approximately -20°C to 100°C, supporting moderate heat-resistant bonding needs.
- Easy Processing and Clean Use: Easy to peel, apply, slit, laminate, and die-cut, making it suitable for converting, production-line assembly, and clean bonding operations.
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- Thicker 0.16mm Construction: Provides a slightly thicker tape structure for applications requiring stable bonding and better handling during converting or assembly.
- Strong Double-sided Adhesion: Delivers reliable adhesion performance with stickiness of ≥18N, suitable for bonding a wide range of industrial materials.
- Good Holding Power: Designed to maintain long-lasting bonding strength, with retention performance of ≥48H / 1kg / in².
- Resistance to Rebound and Warping: Helps reduce edge lifting, curling, bouncing, and deformation after application, especially on curved or slightly uneven surfaces.
- Heat and Temperature Resistance: Suitable for moderate temperature-resistant bonding applications, with a working range of approximately -20°C to 100°C.
- Easy Peeling and Clean Application: Convenient to peel, apply, slit, laminate, and die-cut, supporting efficient production and clean assembly processes.
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- High Initial Adhesion: Provides fast bonding performance after application, suitable for nameplates, films, foam materials, and panel assembly.
- Reliable Peel Strength: Offers stable peel adhesion with a reference 180° peeling force of 13 N/in, supporting secure bonding on suitable surfaces.
- Good Temperature Holding Power: Designed for applications requiring temperature resistance from approximately -20°C to 120°C.
- Thin 0.08mm Tape Structure: Suitable for applications where a thin adhesive layer is required without adding excessive thickness to the finished product.
- Easy Die-cutting and Converting: Tissue backing supports slitting, laminating, die-cutting, and shaped adhesive parts for industrial production.
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Carrier-Free Thermal Interface Tape for Efficient Heat Transfer & Thin Bonding Applications
- Carrier-Free Design for Maximum Thermal Efficiency: Unlike traditional tapes with PET or fiberglass carriers, this product features a pure adhesive structure.
- Excellent Thermal Conductivity: Designed to efficiently transfer heat away from critical components.
- Ultra-Thin & High Conformability: The absence of a carrier allows the tape to adapt to uneven surfaces.
- Strong Adhesion Performance: Provides reliable bonding between different materials. Ensures stable adhesion under thermal cycling conditions.
- Clean Processing & Easy Application: Designed for efficient manufacturing processes.
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- High-Temperature Resistance: Designed to withstand temperatures up to 135°C, the AT412 film remains stable and functional under elevated temperature conditions.
- Superior Wear Resistance: Offers outstanding wear resistance, making it ideal for high-stress industrial applications.
- High Tensile Strength: With a tensile strength ranging from 40 to 68 MPa, the film maintains its integrity even under heavy load.
- Excellent Elongation: The film offers an impressive elongation rate of 300%–480%, ensuring flexibility without cracking.
- Chemical Stability: Highly resistant to a variety of chemicals, making it ideal for industrial and processing environments.
- Electrical Insulation: The film’s surface resistance of10^3 to 10^12 Ω ensures it can be used effectively for electrical insulation applications.
- FDA Approved: Safe for food contact, this film meets FDA standards for food and pharmaceutical applications.
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- Enhanced Adhesion Performance: Modified to improve surface bonding capability, the AT442 film enables stronger adhesion to rubber and other substrates without additional surface treatment.
- Wear Resistance: Maintains the excellent abrasion resistance of UHMW-PE, ensuring long-term durability in high-friction applications.
- High Tensile Strength: With a tensile strength of 40–68 MPa, the film provides reliable mechanical stability under load.
- Excellent Elongation: The elongation range of 300%–480% ensures flexibility and resistance to cracking under dynamic stress.
- Transparent Appearance: The natural (transparent) color allows for visibility and inspection in applications where monitoring is required.
- Stable Surface Resistance: With a surface resistance of 10³ to 10¹² Ω, the material supports a wide range of industrial applications.
- Low Friction Performance: Retains the self-lubricating characteristics of UHMW-PE, reducing wear and energy loss in moving systems.