UV-1608 PO Film Wafer UV Dicing Tape (Substrate UV Dicing Tape Replacement)

Description

The UV-1608 PO Film Wafer UV Dicing Tape is an ultra-strong, single-coated adhesive tape specifically designed for precision wafer dicing in IC and semiconductor applications. Featuring a high-performance silicone adhesive on PO/PET film, it ensures strong adhesion before UV exposure and clean removal after UV exposure, protecting wafers or glass without leaving residue. The tape is suitable for deep-cutting processes for QFN, BGA, and other IC package types.

Key Features

• High Adhesion: Single-coated PO/PET film with special silicone adhesive provides secure adhesion to wafers or glass during grinding and dicing.
• Residue-Free: Leaves no residue on wafer or glass surfaces, ensuring optimal processing quality.
• UV-Activated Release: Adhesion significantly decreases after UV-light exposure, allowing easy removal without damage.
• Durable & Stable: Excellent adhesion maintained during processing, resistant to mechanical stress, preventing wafers from shifting.
• Multiple Thickness Options: Available in 0.05 mm, 0.08 mm, 0.15 mm, and 0.20 mm to meet different wafer support requirements.
• Smooth Surface Contact: Ensures consistent contact with wafers, preventing air bubbles and uneven adhesion.

Applications

• Semiconductor Wafer Dicing: Suitable for QFN, BGA, and various IC packages.
• Glass and Substrate Protection: Prevents wafers or glass from moving or lifting during grinding or cutting.
• IC Manufacturing: Ensures high-precision dicing and reduces the risk of product loss or damage.
• Electronics Assembly: Protects delicate components during processing or temporary storage.
• Laboratory & Research: Ideal for prototyping, testing, and experimental wafer handling.

Technical Specifications

 

Customizable Options

• Thickness: Select from 0.05 mm, 0.08 mm, 0.15 mm, or 0.20 mm.
• Roll Width & Length: Width from 2 mm to 1200 mm; standard length 50 M, customizable on request.
• Die-Cut Shapes: Can be cut into custom shapes or sizes to meet specific wafer or glass layouts.
• Special Adhesive Levels: Adhesion can be adjusted for unique wafer handling requirements.

Ordering & Technical Support

AxisTape provides flexible minimum order quantities, competitive pricing, and worldwide delivery. For custom specifications or technical inquiries, please feel free to contact us for a detailed consultation or email us at info@axistape.com.