UV-1608 PO Film Wafer UV Dicing Tape (Substrate UV Dicing Tape Replacement)
- High Adhesion: Single-coated PO/PET film with special silicone adhesive provides secure adhesion to wafers or glass during grinding and dicing.
- Residue-Free: Leaves no residue on wafer or glass surfaces, ensuring optimal processing quality.
- UV-Activated Release: Adhesion significantly decreases after UV-light exposure, allowing easy removal without damage.
- Durable & Stable: Excellent adhesion maintained during processing, resistant to mechanical stress, preventing wafers from shifting.
- Multiple Thickness Options: Available in 0.05 mm, 0.08 mm, 0.15 mm, and 0.20 mm to meet different wafer support requirements.
- Smooth Surface Contact: Ensures consistent contact with wafers, preventing air bubbles and uneven adhesion.
Reliable Industrial Solutions You Can Trust
- Consistent Industrial Quality
- Fast Sampling & Custom Solutions
- Reliable Global Supply & Technical Support
Description
The UV-1608 PO Film Wafer UV Dicing Tape is an ultra-strong, single-coated adhesive tape specifically designed for precision wafer dicing in IC and semiconductor applications. Featuring a high-performance silicone adhesive on PO/PET film, it ensures strong adhesion before UV exposure and clean removal after UV exposure, protecting wafers or glass without leaving residue. The tape is suitable for deep-cutting processes for QFN, BGA, and other IC package types.
Key Features
- High Adhesion: Single-coated PO/PET film with special silicone adhesive provides secure adhesion to wafers or glass during grinding and dicing.
- Residue-Free: Leaves no residue on wafer or glass surfaces, ensuring optimal processing quality.
- UV-Activated Release: Adhesion significantly decreases after UV-light exposure, allowing easy removal without damage.
- Durable & Stable: Excellent adhesion maintained during processing, resistant to mechanical stress, preventing wafers from shifting.
- Multiple Thickness Options: Available in 0.05 mm, 0.08 mm, 0.15 mm, and 0.20 mm to meet different wafer support requirements.
- Smooth Surface Contact: Ensures consistent contact with wafers, preventing air bubbles and uneven adhesion.
Applications
- Semiconductor Wafer Dicing: Suitable for QFN, BGA, and various IC packages.
- Glass and Substrate Protection: Prevents wafers or glass from moving or lifting during grinding or cutting.
- IC Manufacturing: Ensures high-precision dicing and reduces the risk of product loss or damage.
- Electronics Assembly: Protects delicate components during processing or temporary storage.
- Laboratory & Research: Ideal for prototyping, testing, and experimental wafer handling.
Technical Specifications
| Adhesive Type | Silicone |
| Color | Blue / Transparent |
| Base Film | PO Film |
| Peel Force (Before UV) | 800 gf / 25 mm |
| Peel Force (After UV) | 10 gf / 25 mm |
| Thickness | 0.05 mm / 0.08 mm / 0.15 mm / 0.20 mm |
Customizable Options
- Thickness: Select from 0.05 mm, 0.08 mm, 0.15 mm, or 0.20 mm.
- Roll Width & Length: Width from 2 mm to 1200 mm; standard length 50 M, customizable on request.
- Die-Cut Shapes: Can be cut into custom shapes or sizes to meet specific wafer or glass layouts.
- Special Adhesive Levels: Adhesion can be adjusted for unique wafer handling requirements.
Ordering & Technical Support
AxisTape provides flexible minimum order quantities, competitive pricing, and worldwide delivery. For custom specifications or technical inquiries, please feel free to contact us for a detailed consultation or email us at info@axistape.com.
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