AT Thermal Silicone Die-cut Pad for LED and CPU

Description

AT Thermal Silicone Die-cut Pad for LED and CPU is designed for electronic thermal interface applications where heat needs to be transferred from LEDs, CPUs, ICs, power modules, or other heat-generating components to heat sinks, metal housings, or cooling structures. The soft silicone pad structure helps fill surface gaps and improve contact between uneven surfaces. AxisTape can die-cut the material into custom pads, strips, holes, slots, and special shapes according to customer drawings or assembly requirements.

Key Features

• Thermal Interface Support: Designed to help bridge the contact area between heat-generating components and heat-dissipating structures.
• Soft Silicone Pad Structure: The silicone pad format supports close fitting on uneven surfaces and helps fill small air gaps during assembly.
• LED and CPU Heat Dissipation: Suitable for LED modules, CPUs, ICs, power devices, PCB assemblies, heat sinks, and electronic cooling structures.
• Custom Die-cut Shapes: The material can be processed into pads, strips, holes, rings, slots, tabs, and irregular shapes according to application requirements.
• Assembly-friendly Format: Die-cut thermal pads can simplify installation compared with liquid thermal materials in selected production processes.
• Specification-controlled Development: Thermal conductivity, thickness, hardness, adhesive backing, electrical insulation, flame rating, and temperature range should be confirmed according to the final application.

Applications

• LED Module Heat Transfer: Used between LED components and heat sinks, aluminum substrates, metal housings, or cooling plates.
• CPU and IC Cooling: Suitable for CPU, IC, chipset, memory module, and power device thermal interface applications.
• Power Electronics: Applied in power supplies, converters, control modules, and electronic components requiring heat transfer support.
• PCB Assembly: Used as a gap-filling thermal pad between PCB-mounted components and heat-dissipating structures.
• Heat Sink and Housing Contact: Suitable for improving contact between components and heat sinks, metal enclosures, or cooling frames.
• Custom Die-cut Thermal Parts: Designed for custom pads, sheets, strips, holes, slots, pull-tab shapes, and irregular thermal interface components.

Technical Specifications

Primary Application	LED, CPU, heat sink, electronic heat dissipation and thermal interface applications
Material	Thermal silicone pad; final silicone formulation and filler system to be confirmed
Shape and Size	Customized according to customer drawings, samples, or assembly requirements
Die-cut Options	Pads, sheets, strips, holes, slots, rings, tabs, and irregular thermal interface shapes
Supply Format	Individual die-cut pieces, kiss-cut sheets, sheets, or roll-format die-cut components; final format to be confirmed
Recommended Confirmation Before Mass Production	Thermal conductivity, thickness tolerance, hardness, adhesive configuration, temperature range, flame rating, and electrical insulation performance

 

Customizable Options

• Custom Shape and Size: The material can be die-cut into square pads, round pads, strips, rings, holes, slots, tabs, and irregular profiles according to CAD drawings or samples.
• Thickness and Tolerance: Thickness, tolerance, and compression requirements should be selected according to the final gap height and heat dissipation structure.
• Thermal Performance Selection: Thermal conductivity, thermal resistance, and compression performance can be specified according to LED, CPU, IC, or power module requirements.
• Adhesive Configuration: Adhesive-backed or non-adhesive structures can be selected depending on assembly needs. Adhesive type, liner type, peel tab, and release format should be confirmed before production.
• Supply Format: Products can be supplied as sheets, individual die-cut pieces, kiss-cut sheets, strips, or roll-format die-cut thermal components.
• Application-based Converting: Slitting, laminating, sheet cutting, die cutting, kiss cutting, half cutting, hole punching, pull-tab design, and packaging format can be customized for electronic thermal management projects.

Ordering & Technical Support

AxisTape provides flexible minimum order quantities, competitive pricing, and worldwide delivery. For custom specifications or technical inquiries, please feel free to contact us for a detailed consultation or email us at info@axistape.com.